Amtech understands that in Electronics Manufacturing the first and foremost we need to create a high quality solder joint. To do this for the Low-Volume customer is very costly, and to the High Volume Customer the repeatability is crucial.
That is why Amtech invested in a solution that can solve both requirements in one shot. We did this by acquiring a Vapor Phase Reflow Oven.
A Vapor Phase reflow oven gives us the below advantages over Convection and IR Reflow methods while ensuring the best Reflowed Solder Joint in the Industry. • Controlled Temperature • No Profiling necessary • Cooler reflow to reduce component damage • Consistent reflow for all parts • Better joints for lead free process, especially BGA Assembly. • Eliminates Guessing Game out of BGA Soldering. • More robust process • Process is reproducible in the long and short term • Even heating regardless of component geometry, package, color, weight or board layout. • Oxygen-free-process, oxygen-free pre-heat and soldering process • Lead-free capable without restriction • Optimum process reliability with TGC and ASB • ASB (automatic-solder-break), automatic recognition of the completed soldering process • TGC (temperature-gradient-control), adjustable Temperature gradients in the preheating zone • OPC (optical-process-control), visual process control • Storage of soldering programs • Low operating costs through efficient energy use • High process reliability with on-line long-distance diagnostics • Standardized interface for modern production lines • True Single Batch Capability (no need to scrap boards for thermal profiling)
See the video below for Better insight to Vapor Phase Reflow and its history.
For More Information Regarding Asscon Reflow Ovens contact Allen Duck, www.atekllc.com
